High performance capacitors in planar back gates CMOS

ABSTRACT

A method of manufacture and device for a dual-gate CMOS structure. The structure includes a first plate in an insulating layer and a second plate above the insulating layer electrically corresponding to the first plate. An isolation structure is between the first plate and the second plate.

FIELD OF THE INVENTION

The invention relates to semiconductor devices, and more particularly toultra-thin SOI based dual-gate CMOS capacitors and method ofmanufacture.

BACKGROUND DESCRIPTION

A conventional MOS (metal-oxide semiconductor) capacitor can be modeledas a parallel plate capacitor. In this type of structure, one plate maybe made from a metal or a heavily-doped polycrystalline silicon (“poly”)and one plate may be made from a semiconductor (e.g., the inversionlayer formed when the MOS capacitor is under high forward bias). Aninsulator such as SiO₂ or “oxide”, for example, may be used to separatethe two plates. In deeply scaled ultra-thin SOI (silicon on insulator)devices, the insulation layer, e.g., oxide, beneath the source and drainregions, is made thinner to improve MOS transistor performance. Althoughthis results in a faster transistor, the thinner channel region anddopant solid solubility limits the amount of active dopants that can beplaced in the channel. This results in the effective series resistancebecoming quite large in the capacitor. This may pose many problems froma circuit standpoint.

More specifically, in ultra-thin SOI MOS devices, the n-channel FET ofthe nMOS transistor is made of p-type silicon, and the p-channel FET ofthe pMOS transistor is made of n-type silicon. Heavily-doped source anddrain regions provide electrodes to contact the previously mentionedchannel region. In an SOI MOS device, an oxide region is created beneaththe channel. The oxide region electrically isolates the source, drain,and channel regions of device from the substrate. The MOS thresholdvoltage of the channel, i.e., the gate potential when charge carrierscan flow through the channel from the source to the drain in significantquantities, is determined by factors such as the work function of thegate, any channel dopants, and the dimensions of the transistorstructure. However, low mobile channel charge in a SOI MOS device canunder certain conditions have large effective resistance (equivalentserial resistance (ESR)). This large ESR has a great influence on theperformance of the capacitor. For example, an increase in the effectiveresistance of the capacitor will result in worsening frequencycharacteristics of the capacitor.

A more detailed model of the MOS structure decomposes the verticalgate-dielectric-substrate gate “stack” into two capacitors in series,e.g., a linear oxide capacitance and a nonlinear channel capacitance. Byway of example, if the voltage on the gate is strongly negative on anN-type MOS structure, holes are attracted to the dielectric-substrateinterface and accumulate there. In the accumulation regime, MOScapacitors act approximately as linear capacitors. On the other hand, ifthe gate voltage is made positive on an N-type MOS structure, thesurface is depleted of mobile holes, creating a depleted region withexposed dopant ions. The depletion capacitance is nonlinear due to theapproximately square root dependence of the depletion charge onpotential under the gate dielectric. But, as the gate voltage is raisedfurther, the potential barrier between the source terminal and thechannel is lower electrostatically and the channel is flooded withmobile electrons from the source. It is the presence of electrons inchannel that indicates the inversion of the silicon near the surface,e.g., an NFET channel becomes n-type and analogously a PFET channelbecomes p-type.

In the ultra-thin SOI devices, the depth of the silicon region beneaththe gate stack is made very thin due to transistor scaling rules, wherethe bottom of the silicon region beneath the gate is bounded by theburied oxide. Even at channel doping levels near the solid solubilitylimit, the depletion region induced by the gate can extend from the gateto the back oxide creating a region that is depleted of mobile carriers,(i.e., “fully depleted”).

Weak inversion results when the number of mobile electrons (theinversion charge) is much lower than the number of exposed dopant ionsin the depletion region (the depletion charge). On the other hand,strong inversion results when the inversion charge greatly exceeds thedepletion charge. Also, the transition between strong inversion tomoderate inversion can be defined as the condition when the inversioncharge and the depletion charge are comparable. When the channel areaunder the gate is strongly inverted, the gate charge is balanced outprimarily by the inversion layer charge. The voltage at which inversionlayer charge dominates is called the threshold voltage Vt and Vt₀indicates the threshold voltage when the source voltage equals zero.

In SOI MOS technologies, there are several modes of operation dependingon the application of an external bias to the SOI channel region (alsoreferred to as the silicon body). The silicon body is isolated from thesubstrate by the buried back oxide. This case, the floating body case,the potential in the body is controlled by many physical factorsincluding diode junction currents from the source and drain, impactionization near the drain, gate leakage, bipolar effects, and capacitivecoupling to the device's electrical terminals the gate, source, drain,and body. An SOI body potential can be defined relative to the sourcepotential and the body potential can be significantly forward-biasedwith respect to the source potential during normal operation. If anexternal potential is applied to the SOI body (called a body contact),the body potential is constrained by the external potential and theresistance between the external body contact and the SOI body. Notehowever that in the case of an ultra-thin SOI device with a silicon bodythat has been scaled to the point where it is fully-depleted, theexternal resistance can be so high that the body contact is ineffective.

An extension of the ultra-thin SOI MOS device described above is thedual-gate SOI MOS transistor. In this structure, the back oxide havebeen thinned to the point that the region below the back oxide can exertnon-negligible electrical field on the body and possibly form for aninversion layer or accumulation layer adjacent to the back oxide. When asecond gate electrode is placed in or beneath the back oxide, adual-gate device SOI MOS transistor is formed. Furthermore the secondgate electrode (the back gate) is typically isolated from otherelectrically conductive elements such as the substrate, source, drain,and top gate (front gate).

In conventional MOS process technologies such as SOI or bulk (non-SOI)intentional capacitor circuit elements can be created withoutsignificant extra process steps by using a regular MOS transistor thatis biased in the inversion or accumulation regime. This gives a relativeconstant high value capacitor due to the usage of the regular MOS gateoxide. These capacitors can function as decoupling capacitors or asreactive elements in analog applications. However in dual gateultra-thin SOI the intentional capacitive element formed in this mannercan contain parasitic resistance that is dominated by the fully-depletedbody in some ranges of operation, reducing it usefulness as a circuitdesign element. However, traditional and leading-edge circuit designtechniques still have a need for intentional capacitive elements, sincedual-gate SOI has certain performance advantages over ultra-thin singlegate SOI technologies Therefore it is desirable to introduce intentionalcapacitive circuit elements into dual-gate technologies that are low inparasitic resistance, have high capacitance, and are easy to fabricate.

SUMMARY OF THE INVENTION

In a first aspect of the invention, a method of manufacturing adual-gate CMOS structure includes forming a first plate in an insulatinglayer and forming a second plate above the insulating layer electricallycorresponding to the first plate. The method further includes providingan isolation structure between the first plate and the second plate.

In another aspect of the invention, the method of manufacturing adual-gate CMOS structure includes forming at least one back plate in aninsulating layer and forming at least one front plate above theinsulating layer corresponding to the at least one back plate. Themethod further includes providing a dielectric between the at least oneback plate and the front plate.

In yet another aspect of the invention, a capacitor formed on asubstrate having a buried insulator layer and a device layer on theinsulator layer comprises a lower plate formed in a buried insulatorlayer. A portion of the buried insulator layer is formed on the lowerplate to provide a first capacitor dielectric. A portion of a devicelayer is formed on the first capacitor dielectric and a second capacitordielectric is formed on the portion of the device layer. An upper plateis formed on the second capacitor dielectric.

In another aspect, the invention includes a dual-gate capacitor havingat least one back gate formed in a buried insulator layer and at leastone front gate formed above the buried insulator layer. A dielectriclayer is formed between the at least one front gate and back gate.Diffusion regions are doped adjacent to the at least one back gate.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates steps in manufacturing a device in accordance withthe invention;

FIG. 2 illustrates additional steps in manufacturing the device inaccordance with the invention;

FIG. 3 illustrates additional steps in manufacturing the device inaccordance with the invention;

FIG. 4 illustrates additional steps in manufacturing the device inaccordance with the invention;

FIG. 5 illustrates additional steps in manufacturing the device inaccordance with the invention;

FIGS. 6 a-6 d show top views or wiring schematics of the differentstructures of the invention, manufactured in accordance with the stepsof the invention; and

FIG. 7 shows a side view of the respective structures of FIGS. 6 a-6 d.

DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION

The invention is directed to CMOS structures and more particularly tolow resistance, high value capacitors in scaled dual-gate SOI and amethod of manufacture. By using the dual-gate device and method offabrication of the invention, ultra-thin SOI capacitors with enhancedfunctionality are achieved. By way of example, in one application seriesresistance can be lowered for high frequency operations; whereas, inother applications, high capacitance can be achieved per unit area.

In accordance with the invention, four distinct CMOS capacitorstructures may be manufactured simultaneously, if desired, based onscaled dual-gate SOI technology; namely, the initial structures may beformed with substantially the same processes, with different wiringstructures to obtain desired results. In one application, two structuresare designed to provide high capacitance directly between front and backgates with negligible reduction in series resistance. In anotherstructure, for example, higher capacitance is provided with reducedseries resistance by using both front and back gates electrically tiedtogether, with the active silicon neither inverted or accumulated, thusproviding a capacitive element vertically between the two plates andthrough the fully-depleted channel region.

FIG. 1 shows a beginning structure in accordance with the invention. Inthis structure, an oxide or dielectric layer 100 may be formed on asubstrate 102, using any conventional methods. One such conventionalmethod may include wafer bonding, where another wafer (not shown) withthe oxide layer 100 is bonded to the substrate by van der Waals forces.The substrate wafer 102 may be comprised of silicon, germanium, or otherreadily known materials, and is preferably approximately 500 microns inthickness for purposes of manufacturing processes. A thin layer ofsilicon 104 is provided on the surface of the oxide layer 100. Thesilicon layer 104, in one embodiment, is approximately 50 Å to 400 Åthick, with other dimensions contemplated by the invention. FIG. 1displays all embodiments in close proximity however this is not arequirement for application and one or more embodiments can be placed inarbitrary locations around the chip area.

Prior to the bonding the layers 100, 102, one or more back gates 106a-106 d (also known as plates) are formed in the oxide layer. It shouldbe understood that each back gate 106 a-106 d may be used to form asimilar or different capacitor, depending on the wiring structuredesired for a particular application. For example, in the embodimentshown in FIG. 1, the four back gates 106 a-106 d form structures inregions, a-d, respectively. Additionally, more or less than four backgates may also be formed, again depending on the desired application.Accordingly, it should be understood that the discussion of back gates106 a-106 d are exemplary and should not be considered a limitingfeature of the invention.

In forming the back gates 106 a-106 d, process steps includingconventional standard lithographic and etching processes may beutilized, all known to those of skill in the art. For example, theprocess may include block masks used in combination with Reactive IonEtching (RIE), in certain applications. In implementation, the backgates 106 a-106 d may be polysilicon and conventionally doped, forexample, using phosphorous, boron or arsenic. Also, in embodiments, thecross-section of the back gates 106 a-106 d are of such dimensions so asto minimize any significant gate resistance. For example, the height ofthe back gates 106 a-106 d may be approximately 1000 Å to 2000 Å,although other critical dimensions are also contemplated by theinvention. A space of approximately 10 Å to 100 Å is provided betweenthe top surface of the oxide layer 100 and the back gates 106 a-106 d.This distance demarcates a region that can be referred to as the backgate oxide or dielectric layer, which can be sized to minimize anypotential parasitic effects such as direct tunneling currents.

FIG. 2 represents further processing steps in accordance with theinvention. In FIG. 2, the silicon layer 104 is etched away, usingconventional processes. For example, FIG. 2 is illustrative of an activearea mask that is used to define each isolated capacitor element, whichmay include channel, drain, and source regions. In one application, theactive area mask is placed over regions represented as “a”, “b” and “c”.The structure is then etched in a silicon isolation process, resultingin silicon bodies or islands 104 a, 104 b and 104 c. The silicon layer104 may be completely etched in the region “d”.

Gate oxide or dielectric layers 108 a, 108 b, 108 c are then thermallygrown or deposited on the silicon bodies 104 a, 104 b, and 104 c,respectively. In one embodiment, the gate oxide layers 108 a, 108 b, 108c are formed to a thickness of approximately 10 Å to 100 Å, similar tothe spacing of the oxide layer 100 between the back gates 106 a-106 dand the silicon layer 104. This oxide layer may be used to form theactual capacitor(s) of the invention.

FIG. 3 is representative of a gate material 110 (e.g., polysilicon)being deposited on the structure of FIG. 2. This material 110 is used toform the front gates, using subsequent steps described below. The gatematerial 110 may be heavily doped (e.g., 10²⁰ cm⁻³) however notnecessarily the same dopant species is used with the back gates 106a-106 b. High dopant levels of species such as phosphorous, boron orarsenic are used to minimize polysilicon depletion effects. Theconsiderations for the dimensions of the polysilicon material 110 arealso substantially the same as that of the back gates 106 a-106 c. Forexample, the cross section of the poly material 110 is of suchdimensions so as to minimize any significant gate resistance, e.g.,approximately 1000 Å to 2000 Å, although other critical dimensions arealso contemplated by the invention.

FIG. 4 is illustrative of an exemplary patterning and etching process inorder to form the front gates 110 a-110 d. In one process, the formationof the front gate 110 d of section “d” may be formed separately fromthat of the remaining front gates 110 a-110 c. This is due to the frontgate 110 d being etched more deeply since the silicon layer 104 andsubsequent oxide layer is not provided over this region. In one example,a protecting mask may be placed over region “d” during the processesforming the front gates 110 a-110 c. Likewise, a protecting mask may beplaced over regions “a”, “b” and “c”, during the formation of the frontgate 110 d. These processes are well known in the art to those of skillsuch that further discussion is not required herein for a completeunderstanding of the invention.

FIG. 5 illustrates several processing steps including the formation ofspacers, source and drain regions and silicide. In the illustration ofFIG. 5, only the CMOS structure for region “a” is shown; however, itshould be understood that the processes discussed with reference tosection “a” are equally applicable for the formation of the structuresin regions “b”, “c” and “d”. Accordingly, the exemplary illustration ofFIG. 5 can be used for the formation of the source, drain, sidewalls andsilicide formations on any of the structures shown in FIGS. 6 a-7.

By way of example, referring to region “a”, the source and drain regions112 ₁ and 112 ₂, are formed in the silicon body in any conventionalmanner. An isolation region 105 is adjacent the source and drain regions112 ₁ and 112 ₂. Spacers 114 are formed on the sidewalls of the frontgate 110 a and the front oxide layer 108 a, extending to the dopedsource and drain regions 112 ₁ and 112 ₂, respectively. These regionscan be doped using phosphorous, boron or arsenic, preferably resultingin the range of 1×10²⁰ particles/cm³ for the source and drain, buttypically lower levels for other doped regions such as halo or extensionimplants that may be part of the conventional transistor process intowhich the dual-gate MOS capacitor is being included. A silicide layer116 is formed on the exposed silicon layer at the doped source and drainregions 112 ₁ and 112 ₂, respectively, in addition to a top surface ofthe front gate 110 a. The formation of the silicide and spacers are wellknown in the art by those of skill in the art.

FIGS. 6 a-6 d show top views of wiring schematics of the differentstructures “a” through “d” described with reference to FIGS. 1-5. InFIG. 6 a, a dual-gate FET capacitor is shown, corresponding to themanufacturing processes described for section “a”. In the FET capacitorof FIG. 6 a, a first wire “A” contacts the front gate 110 a and forms afirst terminal of the capacitor. A second wire “B” contacts the backgate 106 a, in addition to both opposing sides of the silicon layer, andforms the second terminal of the capacitor. Thus, in this structure, thecapacitor is formed from the “A” electrode, through the structure to the“B” electrode, which results in the source and drain shorted together.Alternatively, the roles of the back gate and the front gate can bereversed, with the “B” electrode consisting of the back gate and the “A”terminal consisting to the diffusion regions tied to the front gate.

FIG. 6 b is a dual-gate capacitor using the structure formed in region“b” of FIGS. 1-5, with the wiring schematic shown herein. In thehigh-density capacitor of FIG. 6 b, a first wire “A” contacts both sidesof the silicon layer diffusion regions and forms a first terminal of thecapacitor. A second wire “B” contacts the front gate 110 b and the backgate 106 b and forms the second terminal of the capacitor. Thus, in thisstructure, the wire “A” ties together the two sides of the silicon,while the wire “B” ties together the front gate 110 b and the back gate106 b. The device of FIG. 6 b provides increased capacitance as thedevice of FIG. 6 a due to the front and back channel charge regionsfunctioning electrically together.

In the capacitor structure of FIGS. 6 a and 6 b, high capacitance ispossible because of the thin dielectric layer (a process step that ispotentially shared with the conventional MOS transistor process thatincludes these dual-gate capacitors) directly between the front and backgates 106 a and 110 a, respectively. Also, since the outer edges(diffusions) of the silicon are connected together by wire “B”, the topportion of the structure looks similar to a conventional MOSFET. And, inthis case, an inversion layer can be formed beneath the top oxide layer108 a. That is, the dual-gate structure also allows both devices to havean inversion channel forms under the oxide layer 108 a.

Also, accumulation or diffusion effects can occur since the front gateis formed over the silicon and there are two diffusions wired out at anelectrically different potential from the front gate. Thus, as should beunderstood by this wiring schematic, if the potential of the “B” wiregoes above the front or back gate threshold voltage with respect to thediffusion, an inversion layer will form; whereas, if the potential ofthe wire “B” has low enough bias with respect to the diffusionpotential, an accumulation layer will occur under one or both of thecapacitor oxides. It is recognized that opposite biasing results occurin p-type and n-type devices.

FIG. 6 c is a dual-gate capacitor using the structure formed in region“c” of FIGS. 1-5, with the wiring schematic shown herein. In the wiringstructure of FIG. 6 c, a first wire “A” contacts the front gate 110 cand forms a first terminal of the capacitor. A second wire “B” contactsthe back gate 106 c and forms the second terminal of the capacitor. Ahigh potential (for example Vdd) contacts both sides (diffusions) of thesilicon layer. From an electrical standpoint, the thin-body structure ofFIG. 6 c is fully-depleted and has field lines substantially penetratingthe structure from “A” to “B”, e.g., the front gate 110 c to the backgate 106 c. The dual-gate capacitor of FIG. 6 c offers low seriesresistance for high-frequency operation (similar to that of FIG. 6 d).

In the device of FIG. 6 c, an inversion layer cannot form because thepotential on the gate does not exceed the potential of the diffusion. Aninversion layer may form when the gate potential, relative to one of theoutside diffusion potentials, is above a MOS FET threshold and there isa source of carriers around, which is the source and drain. But, this isnot desirable due to resistance issues. This phenomenon is eliminated inthe device of FIG. 6 c since the potential on the diffusions is high andthe potentials on “A” and “B” are operated below that potential. Also,an accumulation can occur if the gate terminal goes too low; however,the assumption is that the device of FIG. 6 c is operated so that thisdoes not occur since there is roughly 1.2 volts (or the bandgappotential) between the high diffusion potential and the bias whereaccumulation would occur.

FIG. 6 d is a gate capacitor using the structure formed in region “c” ofFIGS. 1-5, with the wiring schematic shown herein. In the capacitor ofFIG. 6 d, a first wire “A” contacts the front gate 110 d and forms afirst terminal of the capacitor. A second wire “B” contacts the backgate 106 d and forms the second terminal of the capacitor. The device ofFIG. 6 d offers low series resistance for high-frequency operations andhigh capacitance per unit area based on scaling of the back oxidethickness.

FIG. 7 shows a side view of the respective structures of FIGS. 6 a-6 d.The first wire “A” and the second wire “B” are representative of therespective terminals of the devices shown in FIGS. 6 a-6 d. FIG. 7 alsoclearly illustrates the regions “a”, “b”, “c” and “d” representative ofthe devices shown and described in FIGS. 6 a-6 d, respectively. In thisillustration, two dielectric or oxide layers separate the front gates110 a-110 c and the back gates 106 a-106 c. A contribution to parasiticresistance, direct tunneling through either the front or back gate iscontrolled by selecting the appropriate oxide thickness such thatleakage current is minimized.

While the invention has been described in terms of exemplaryembodiments, those skilled in the art will recognize that the inventioncan be practiced with modifications and in the spirit and scope of theappended claims.

1. A method of manufacturing a dual-gate CMOS structure, comprising:forming a first plate buried in an insulating layer such that a portionof the insulating layer provides a spacing between a top surface of theinsulating layer and the first plate; while the portion of theinsulating layer is arranged over the first plate, forming a secondplate above the portion of the insulating layer electricallycorresponding to the first plate; providing an isolation structurebetween the first plate and the second plate; and doping the isolationstructure to form diffusion regions between the first plate and thesecond plate, wherein: the isolation structure includes a dielectriclayer surrounding a silicon island and in contact with the insulatinglayer, and the insulating layer forms a back plate insulating structurebetween the first plate and the silicon island.
 2. The method of claim1, wherein the isolation structure forms the dielectric layer above thefirst plate.
 3. The method of claim 1, wherein the isolation structureis approximately 50 Å to 400 Å thick.
 4. The method of claim 1, whereina height of either of the first plate and the second plate isapproximately 1000 Å to 2000 Å.
 5. The method of claim 1, wherein thedielectric layer is thermally grown on the silicon island.
 6. The methodof claim 1 wherein the dielectric layer and the back plate insulatingstructure are each approximately 10 Å to 100 Å thick.
 7. The method ofclaim 1, further comprising: forming a first terminal connected to thefirst plate and to opposing sides of the silicon island using diffusionregions formed on the silicon island; and forming a second terminalconnected to the second plate.
 8. The method of claim 1, furthercomprising: forming a first terminal connected to opposing sides of thesilicon island at diffusions regions; and forming a second terminalconnected to the first plate and the second plate.
 9. The method ofclaim 1, further comprising: forming a first terminal connected to thesilicon island; forming a second terminal connected to the first plate;forming a third terminal connected to the second plate; and providing ahigher potential to the first terminal than the second terminal or thethird terminal.
 10. The method of claim 1, wherein the isolationstructure is formed from a silicon layer which is entirely etched awaybetween the first plate and the second plate such that the second plateis formed directly on the insulating layer and further comprising:forming a first terminal connected to the first plate; and forming asecond terminal connected to the second plate.
 11. The method of claim1, further comprising providing capacitance directly between the firstplate and the second when the silicon body between the plates isfully-depleted.
 12. The method of claim 1, further comprising: formingan inversion layer beneath a top portion of the insulating layers when apotential of a wire shorting between diffusion regions formed on theisolation structure with respect to one diffusion region of thediffusion regions causes channel inversion; and forming an accumulationlayer beneath the top portion of the insulating layers when thepotential of the wire is high with respect to the one diffusion region.13. The method of claim 1, further comprising: forming at least anotherplate in the insulating layer; forming at least another plate above theinsulating layer corresponding to the at least another plate in theinsulating layer; and providing an isolation island and dielectricstructure between the at least another plate in the insulating layer andabove the insulating layer.
 14. The method of claim 1, wherein thedielectric layer is formed to expose portions of the insulating layer.15. A method of manufacturing a dual-gate CMOS structure, comprising:forming at least one back plate in an insulating layer such that aportion of the insulating layer provides a spacing between a top surfaceof the insulating layer and the at least one back plate; while theportion of the insulating layer is arranged over the at least one backplate, forming at least one front plate above the portion of theinsulating layer corresponding to the at least one back plate; andproviding a dielectric structure between the at least one back plate andthe front plate, wherein the dielectric structure is a back gatedielectric layer and a front gate dielectric layer, the front gatedielectric layer is formed between a silicon based island and the atleast one front plate, and in contact with the back gate dielectriclayer, and the dielectric structure surrounds the silicon based island.16. The method of claim 15, further comprising doping an isolationisland formed in the dielectric structure to form diffusion regions. 17.The method of claim 15, further comprising: etching portions of thesilicon layer to form isolated islands corresponding to the at least oneback plate and the at least one front plate; doping portions of theisolated islands to form diffusion regions, wherein the dielectricstructure is a back gate dielectric layer provided between the backplate and the isolated islands, and a front gate dielectric formedbetween the isolated islands and the front plate.
 18. The method ofclaim 15, further comprising doping diffusion regions associated withthe at least one back plate and front plate.
 19. The method of claim 15,wherein: the dielectric is a first dielectric and a second dielectricboth approximately 10 Å to 100 Å thick; and the front plate and the backgate have a critical dimension of approximately 1000 Å to 2000 Å. 20.The method of claim 15, wherein the front gate dielectric layer isformed to expose portions of the insulating layer.
 21. The method ofclaim 18, wherein the dielectric structure is a front plate dielectricand a back plate dielectric separated by diffusion regions.
 22. Themethod of claim 21, further comprising: forming a first terminalconnected to the back plate and opposing sides of the diffusion regionsto short the diffusion regions; and forming a second terminal connectedto the front plate.
 23. The method of claim 21, further comprising:forming a first terminal connected to the diffusions regions; andforming a second terminal connected to the front plate and the backplate.
 24. The method of claim 21, further comprising: forming a firstterminal connected to the one diffusion region of the diffusion regions;forming a second terminal connected to the front plate; and forming athird terminal connected to the back plate; and providing a higherpotential to the first terminal than the second terminal or the thirdterminal.
 25. A method of manufacturing a dual-gate CMOS structure,comprising: forming at least one back plate in an insulating layer suchthat a portion of the insulating layer provides a spacing between a topsurface of the insulating layer and the at least one back plate; whilethe portion of the insulating layer is arranged over the at least oneback plate, forming at least one front plate above the portion of theinsulating layer corresponding to the at least one back plate; andproviding a dielectric structure between the at least one back plate andthe front plate, wherein: the at least one back plate is at least twoback plates; the at least one front plate is at least two front plates;and the dielectric structure contains a first dielectric and a seconddielectric wherein the dielectric structure is a back gate dielectriclayer and a front gate dielectric layer, the front gate dielectric layeris formed between a silicon based island and the at least one frontplate, and in contact with the back gate dielectric layer, and thedielectric structure surrounds the silicon based island.
 26. The methodof claim 25, wherein the two front gates are at least a first front gateand a second front gate, the first and second front gate being formedsimultaneously in a same process.
 27. The method of claim 25, whereinthe two or more front gates are a first front gate and a second frontgate, the first and second front gate being formed separately.
 28. Amethod of manufacturing a dual-gate CMOS structure, comprising: forminga first plate buried in an insulating layer such that a portion of theinsulating layer provides a spacing between a top surface of theinsulating layer and the first plate; while the portion of theinsulating layer is arranged over the first plate, forming a secondplate above the spacing; and providing an isolation structure betweenthe first plate and the second plate, wherein: the isolation structureincludes a dielectric layer surrounding a silicon island and in contactwith the insulating layer, and the insulating layer forms a back plateinsulating structure between the first plate and the silicon island. 29.The method of claim 28, wherein the method forms an ultra-thin SOIcapacitor.
 30. The method of claim 29, wherein the insulating layercomprises a BOX layer.
 31. The method of claim 30, further comprisingdoping the isolation structure to form diffusion regions between thefirst plate and the second plate.
 32. The method of claim 31, furthercomprising: forming a first terminal; and forming a second terminalconnected to the first plate and the second plate.